US 12,000,885 B1
Multiplexed thermal control wafer and coldplate
Samer Kabbani, Laguna Niguel, CA (US); Taneli Veistinen, Lieto (FI); Terry Sinclair Connacher, Tempe, AZ (US); Sami Mikola, Mynämäki (FI); Thomas P. Jones, Escondido, CA (US); and Ari Kuukkala, Turku (FI)
Assigned to AEM Singapore Pte. Ltd., Singapore (SG)
Filed by AEM Singapore Pte. Ltd., Singapore (SG)
Filed on Dec. 20, 2023, as Appl. No. 18/390,918.
Int. Cl. G01R 31/28 (2006.01)
CPC G01R 31/2875 (2013.01) [G01R 31/2877 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A thermal control assembly (TCA) comprising:
a plurality of independently controllable thermal zones comprising a plurality of independently controllable heater zones and a plurality of independently controllable cooling zones configured to maintain or change a temperature of a top surface of the TCA,
wherein an energy input to the TCA is selectively applied to one or more of the plurality of independently controllable heater zones.