US 12,000,036 B2
Substrate treating apparatus and substrate treating method
Hirofumi Tonai, Kyoto (JP)
Assigned to SCREEN Holdings Co., Ltd., (JP)
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
Filed on Nov. 12, 2021, as Appl. No. 17/524,797.
Claims priority of application No. 2020-198316 (JP), filed on Nov. 30, 2020.
Prior Publication US 2022/0170147 A1, Jun. 2, 2022
Int. Cl. C23C 14/35 (2006.01); B25B 11/00 (2006.01); C23C 14/50 (2006.01)
CPC C23C 14/351 (2013.01) [B25B 11/00 (2013.01); C23C 14/505 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A substrate treating apparatus for performing a predetermined treatment on a substrate, the apparatus comprising:
a spin table configured to be rotatable around a vertical axis;
a rotational driving device configured to rotate the spin table in a horizontal plane;
a holding mechanism configured to hold the substrate in a horizontal posture while the substrate is spaced apart from a top face of the spin table, the holding mechanism including:
a plurality of support pins provided so as to be rotatable freely around the vertical axis on a part of the top face of the spin table adjacent to an outer circumference, and configured to rotate between a holding position contacting a periphery edge of the substrate for restricting movement of the substrate in a horizontal direction, and a delivery position spaced apart from the periphery edge of the substrate for allowing movement of the substrate;
a first magnetic part configured to rotate the support pins individually between the holding position and the delivery position by switching surrounding magnetic poles; and
a second magnetic part configured to rotate the support pins individually to the holding position by constantly applying a magnetic field to the first magnetic part; and
a switching mechanism provided with a third magnetic part having a larger magnetic force than that of the second magnetic part and configured to apply no magnetic field of the third magnetic part to the first magnetic part when the substrate is not being delivered and to apply a magnetic field of the third magnetic part to the first magnetic part to rotate the support pins individually to the delivery position only when the substrate is delivered;
wherein the first magnetic part and the second magnetic part are located concyclically around a rotation center of the spin table in plan view.