US 12,000,030 B2
Copper alloy film with high strength and high conductivity
Herng-Jeng Jou, San Jose, CA (US); Jacob L. Smith, Sunnyvale, CA (US); and Weiming Huang, State College, PA (US)
Assigned to APPLE INC., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on May 2, 2022, as Appl. No. 17/661,695.
Claims priority of provisional application 63/185,679, filed on May 7, 2021.
Prior Publication US 2022/0356546 A1, Nov. 10, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C22C 9/00 (2006.01); C23C 14/14 (2006.01); C23C 14/34 (2006.01); C25D 3/38 (2006.01); H01M 4/02 (2006.01); H01M 4/66 (2006.01); H01M 10/0525 (2010.01)
CPC C22C 9/00 (2013.01) [C23C 14/14 (2013.01); C23C 14/34 (2013.01); C25D 3/38 (2013.01); H01M 4/662 (2013.01); H01M 10/0525 (2013.01); C22C 2200/00 (2013.01); H01M 2004/021 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An alloy, comprising:
copper (Cu);
one of silver (Ag) or cobalt (Co), the alloy comprising between 0.5-2 at % of one of the silver or the cobalt; and
crystal grains, at least 90% of the crystal grains comprising nanotwin boundaries.