US 11,999,875 B2
Polishing solution and polishing method
Yuya Otsuka, Tokyo (JP); Hisataka Minami, Tokyo (JP); Shingo Kobayashi, Tokyo (JP); Mayumi Komine, Tokyo (JP); and Hisato Takahashi, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 17/438,808
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
PCT Filed Jun. 6, 2019, PCT No. PCT/JP2019/022612
§ 371(c)(1), (2) Date Sep. 13, 2021,
PCT Pub. No. WO2020/245994, PCT Pub. Date Dec. 10, 2020.
Prior Publication US 2022/0251422 A1, Aug. 11, 2022
Int. Cl. C09G 1/02 (2006.01); H01L 21/3105 (2006.01)
CPC C09G 1/02 (2013.01) [H01L 21/31053 (2013.01)] 19 Claims
 
1. A polishing liquid comprising: abrasive grains containing a metal oxide; at least one hydroxy acid compound selected from the group consisting of a hydroxy acid having a structure represented by General Formula (A1) below and a salt thereof; and water:

OG Complex Work Unit Chemistry
wherein in the formula, R11 represents a hydrogen atom or a hydroxy group, R12 represents a hydrogen atom, an alkyl group, or an aryl group, n11 represents an integer of 0 or more, and n12 represents an integer of 0 or more; however, a case where both of R11 and R12 are a hydrogen atom is excluded and a case where R11 is a hydrogen atom, R12 is a methyl group, n11 is 0, and n12 is 0 is excluded, and
a ratio of a content of the hydroxy acid compound with respect to a content of the abrasive grains is 0.01 to 0.50.