US 11,999,719 B2
Solid form of compound
Zaiqi Wang, Shanghai (CN); Jing Gao, Shanghai (CN); and Yingxia Sang, Shanghai (CN)
Assigned to INXMED (NANJING) CO., LTD., Nanjing (CN)
Filed by INXMED (NANJING) CO., LTD., Nanjing (CN)
Filed on Jul. 5, 2023, as Appl. No. 18/347,335.
Application 18/347,335 is a continuation of application No. 18/019,747, previously published as PCT/CN2021/110069, filed on Aug. 2, 2021.
Claims priority of application No. 202010768730.1 (CN), filed on Aug. 3, 2020; and application No. 202010837005.5 (CN), filed on Aug. 19, 2020.
Prior Publication US 2024/0051942 A1, Feb. 15, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. C07D 401/14 (2006.01)
CPC C07D 401/14 (2013.01) [C07B 2200/13 (2013.01)] 12 Claims
 
1. A crystalline form A of a compound of formula (I):

OG Complex Work Unit Chemistry
which is a free base of the compound of formula (I), characterized by an X-ray powder diffraction (XRPD) pattern comprising peaks at 10.979, 19.26, 21.581 and 24.801 degrees 2θ.