US 11,999,108 B2
Three-dimensional shaping device
Akihiko Tsunoya, Okaya (JP); Kaoru Momose, Hara-mura (JP); and Toshimitsu Hirai, Hokuto (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Jul. 20, 2021, as Appl. No. 17/443,039.
Claims priority of application No. 2020-125892 (JP), filed on Jul. 23, 2020.
Prior Publication US 2022/0024133 A1, Jan. 27, 2022
Int. Cl. B29C 64/118 (2017.01); B29C 64/165 (2017.01); B29C 64/209 (2017.01); B29C 64/227 (2017.01); B29C 64/35 (2017.01); B29K 67/00 (2006.01); B33Y 40/20 (2020.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01)
CPC B29C 64/35 (2017.08) [B29C 64/165 (2017.08); B29C 64/209 (2017.08); B29C 64/227 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/20 (2020.01)] 9 Claims
OG exemplary drawing
 
1. A three-dimensional shaping device, comprising:
a shaping table;
a layer forming unit configured to form a powder layer on the shaping table;
a head configured to eject a liquid containing a binder from a nozzle to a shaping region of a three-dimensional shaped object on the powder layer; and
a control unit configured to control movement of the head with respect to the shaping table and driving of the head by applying a voltage, and to control the head to execute a flushing operation at a flushing position which is a position different from the shaping region, wherein
the control unit is configured to
control the head to execute a first flushing operation under a first flushing condition that a distance between the shaping region and the flushing position is less than a threshold value, and
control the head to execute a second flushing operation, which is different from the first flushing operation, under a second flushing condition that the distance between the shaping region and the flushing position is equal to or greater than the threshold value.