US 11,999,018 B2
SnBi and SnIn solder alloys
Francis M. Mutuku, Utica, NY (US); Ning-Cheng Lee, Utica, NY (US); and Hongwen Zhang, Utica, NY (US)
Assigned to INDIUM CORPORATION, Utica, NY (US)
Filed by INDIUM CORPORATION, Utica, NY (US)
Filed on Aug. 30, 2019, as Appl. No. 16/557,587.
Claims priority of provisional application 62/726,181, filed on Aug. 31, 2018.
Prior Publication US 2020/0070287 A1, Mar. 5, 2020
Int. Cl. B23K 35/26 (2006.01); B23K 35/02 (2006.01); B23K 101/42 (2006.01); C22C 12/00 (2006.01); C22C 13/02 (2006.01); C22C 30/06 (2006.01)
CPC B23K 35/262 (2013.01) [B23K 35/0244 (2013.01); B23K 35/025 (2013.01); B23K 35/264 (2013.01); C22C 12/00 (2013.01); C22C 13/02 (2013.01); C22C 30/06 (2013.01); B23K 2101/42 (2018.08)] 12 Claims
OG exemplary drawing
 
1. A solder alloy, consisting of:
50 wt % to 60 wt % Bi;
about 0.02 wt % Ni;
greater than 0 wt % to 2 wt % Ag;
greater than 0 wt % to 1 wt % Cu; and
a remainder of Sn, wherein the solder alloy has a liquidus temperature of less than 200° C.