	US 11,998,949 B2
	Acoustic transduction structure and manufacturing method thereof and acoustic transducer
Tuo Sun, Beijing (CN)
Assigned to Beijing BOE Technology Development Co., Ltd., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Filed by Beijing BOE Technology Development Co., Ltd., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Filed on May 27, 2021, as Appl. No. 17/332,869.
Claims priority of application No. 202011186613.0 (CN), filed on Oct. 29, 2020.
Prior Publication US 2022/0134381 A1, May 5, 2022
Int. Cl. B06B 1/02 (2006.01)

CPC B06B 1/0292 (2013.01)

14 Claims

1. An acoustic transduction structure, comprising: a base substrate and at least two acoustic transduction units on the base substrate, wherein,

the at least two acoustic transduction units comprise: a central acoustic transduction unit and at least one annular acoustic transduction unit around and spaced apart from the central acoustic transduction unit;

wherein the at least one annular acoustic transduction unit comprises a plurality of annular acoustic transduction units; and

the plurality of annular acoustic transduction units are provided on the base substrate around the central acoustic transduction unit and are sequentially provided along a direction away from the central acoustic transduction unit;

wherein each of the at least two acoustic transduction units comprises:

a first electrode on the base substrate;

a support pattern on a side of the first electrode distal to the base substrate, wherein the support pattern surrounds to form a vibrating cavity of the acoustic transduction unit;

a vibrating diaphragm pattern on a side of the support pattern distal to the first electrode, and configured to vibrate in the vibrating cavity; and

a second electrode on a side of the vibrating diaphragm pattern distal to the first electrode, and opposite to the first electrode,

wherein shapes of orthographic projections of the first electrode, the second electrode and the vibrating cavity of the central acoustic transduction unit on the base substrate each are a circular shape, and/or shapes of orthographic projections of the first electrode, the second electrode and the vibrating cavity in each of the plurality of annular acoustic transduction units on the base substrate each are an annular shape;

the orthographic projection of the first electrode of each of the plurality of annular acoustic transduction units on the base substrate surrounds the orthographic projection of the first electrode in the central acoustic transduction unit on the base substrate;

the orthographic projection of the vibrating cavity of each of the plurality of annular acoustic transduction units on the base substrate surrounds the orthographic projection of the vibrating cavity of the central acoustic transduction unit on the base substrate; and

the orthographic projection of the second electrode of each of the plurality of annular acoustic transduction units on the base substrate surrounds the orthographic projection of the second electrode of the central acoustic transduction unit on the base substrate;

wherein the first electrode of the central acoustic transduction unit is in a same layer as the first electrodes in the annular acoustic transduction units;

the support pattern of the central acoustic transduction unit is in a same layer as the support patterns of the plurality of annular acoustic transduction units;

the vibrating diaphragm pattern of the central acoustic transduction unit is in a same layer as the vibrating diaphragm patterns of the plurality of annular acoustic transduction units; and

the second electrode of the central acoustic transduction unit is in a same layer as the second electrodes of the plurality of annular acoustic transduction units, and

the acoustic transduction structure further comprises: an insulating layer and a signal wiring layer, wherein the signal wiring layer is between the base substrate and the first electrodes, the insulating layer is between the signal wiring layer and the first electrodes, and the insulating layer has a plurality of vias therein; and

the signal wiring layer comprises: a plurality of signal wirings, and the first electrode of each of the at least two acoustic transduction units is connected with a corresponding one of the plurality of signal wirings through a corresponding one of the plurality of vias.