US 11,997,958 B2
Technique to improve waterproofness and dust resistance for circuit board in job-site gear
Akihiro Hozumi, Anjo (JP)
Assigned to MAKITA CORPORATION, Anjo (JP)
Filed by MAKITA CORPORATION, Anjo (JP)
Filed on Oct. 8, 2021, as Appl. No. 17/497,601.
Claims priority of application No. 2020-171929 (JP), filed on Oct. 12, 2020.
Prior Publication US 2022/0110273 A1, Apr. 14, 2022
Int. Cl. A01G 20/47 (2018.01); A01D 34/90 (2006.01); A47L 5/36 (2006.01); F16M 13/04 (2006.01); H05K 5/00 (2006.01); H05K 3/34 (2006.01)
CPC A01G 20/47 (2018.02) [A01D 34/90 (2013.01); A47L 5/36 (2013.01); F16M 13/04 (2013.01); H05K 5/0034 (2013.01); A01D 2034/907 (2013.01); H05K 3/3447 (2013.01); H05K 2201/1056 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A job-site gear comprising:
a circuit board having a first surface and a second surface, wherein: the first surface includes a first area, a second area and a third area; the third area is between the first area and the second area; the second surface is behind the first surface; the second surface includes a fourth area, a fifth area, and a sixth area; the fourth area, the fifth area, and the sixth area are behind the first area, the second area, and the third area, respectively; and the third area and the sixth area include at least one slit penetrating through the circuit board;
at least one electronic component mounted on the first area; and
a resin member integrally molded so as to (i) penetrate through the at least one slit and (ii) cover the first area, the fourth area, and a part of the at least one electronic component with the second area and the fifth area extending out of the resin member such that the second area and the fifth area are not covered by the resin member.