US 11,032,953 B2
Mutually shielded printed circuit board assembly
Jason Allen Harrigan, Sultan, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Apr. 25, 2019, as Appl. No. 16/394,996.
Prior Publication US 2020/0344924 A1, Oct. 29, 2020
Int. Cl. H05K 7/00 (2006.01); H05K 9/00 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01)
CPC H05K 9/0024 (2013.01) [H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 3/341 (2013.01); H05K 3/3494 (2013.01); H05K 3/368 (2013.01); H05K 2201/042 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10371 (2013.01); H05K 2203/166 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic assembly, comprising:
a first printed circuit board (PCB) including a first plurality of electronic components mounted on a first surface and a first conductive layer;
a second PCB including a second plurality of electronic components mounted on a second surface and a second conductive layer; and
a grounding shield electrically connected between the first conductive layer of the first PCB and the second conductive layer of the second PCB to electrically connect the first PCB and the second PCB, where the grounding shield at least partially shields at least one of the first plurality of electronic components and/or at least one or the second plurality of electronic components, where the grounding shield comprises a surface-mountable electronic component extending physically between the first surface of the first PCB and the second surface of the second PCB and electrically connected to both of the first conductive layer of the first PCB and the second conductive layer of the second PCB, and
where the first PCB and the second PCB are arranged in a stack such that the first surface of the first PCB opposes the second surface of the second PCB and such that the first conductive layer, the second conductive layer and the surface mountable electronic component collectively shield at least one of the first plurality of electronic components and at least one of the second plurality of electronic components from electromagnetic interference.