US 11,032,901 B2
Printed circuit board and electronic device having the same
Jung-Hwan Park, Suwon-si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed on Oct. 24, 2019, as Appl. No. 16/662,163.
Claims priority of application No. 10-2018-0141583 (KR), filed on Nov. 16, 2018.
Prior Publication US 2020/0163203 A1, May 21, 2020
Int. Cl. H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/00 (2006.01); G02B 6/12 (2006.01); G02B 6/43 (2006.01); G02B 6/138 (2006.01); H04R 25/00 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 3/46 (2006.01); H01Q 1/38 (2006.01); H01Q 1/24 (2006.01)
CPC H05K 1/0237 (2013.01) [H01Q 1/38 (2013.01); H05K 1/0277 (2013.01); H05K 1/148 (2013.01); H05K 1/185 (2013.01); H05K 1/189 (2013.01); H05K 3/32 (2013.01); H05K 3/4691 (2013.01); H01Q 1/243 (2013.01); H05K 2201/10098 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a first flexible insulating layer;
a first rigid insulating layer stacked on a first portion of the first flexible insulating layer; and
an electronic element embedded in the first flexible insulating layer in stacked formation with the rigid insulating layer,
wherein the first flexible insulating layer comprises a thermoplastic resin layer and a thermosetting resin layer, and
wherein the electronic element is embedded in the thermoplastic resin layer.