US 12,324,342 B2
Display device acquiring fingerprint pattern and touch pressure information using a single structure
Hee Kwon Lee, Asan-si (KR); and Sung Un Park, Suwon-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Oct. 31, 2022, as Appl. No. 18/051,501.
Application 18/051,501 is a continuation of application No. 16/138,308, filed on Sep. 21, 2018, granted, now 11,487,380.
Claims priority of application No. 10-2018-0037474 (KR), filed on Mar. 30, 2018.
Prior Publication US 2023/0083928 A1, Mar. 16, 2023
Int. Cl. G06F 3/041 (2006.01); G06F 3/044 (2006.01); G06V 10/147 (2022.01); G06V 40/13 (2022.01); H10K 59/12 (2023.01); H10K 59/40 (2023.01); H10K 59/65 (2023.01); H10K 77/10 (2023.01); H10F 39/12 (2025.01); H10K 102/00 (2023.01)
CPC H10K 59/65 (2023.02) [G06F 3/0416 (2013.01); G06F 3/044 (2013.01); G06V 10/147 (2022.01); G06V 40/1318 (2022.01); H10K 59/12 (2023.02); H10K 59/40 (2023.02); H10K 77/111 (2023.02); H10F 39/198 (2025.01); H10K 2102/311 (2023.02)] 26 Claims
OG exemplary drawing
 
1. A display device comprising:
a display panel;
a fingerprint sensor package disposed on the display panel; and
a circuit board base electrically connected to the fingerprint sensor package,
wherein the fingerprint sensor package includes:
a first base including a first portion and a second portion;
an image sensor disposed on a first surface of the first portion which faces the display panel;
an image sensor integrated circuit (IC) disposed on a first surface of the second portion;
a connector portion extending from the second portion,
a connector connected to the connector portion, and
a first conductive layer disposed on a second surface of the first portion and overlapping the image sensor,
wherein the connector is connected to conductive patterns on a first surface of the circuit board base,
wherein a vertical level of the first portion is identical to a vertical level of the second portion,
wherein a vertical level of the connector is different from the vertical level of the first portion and the vertical level of the second portion,
wherein a vertical level of the first conductive layer is between a vertical level of the first portion and the vertical level of the connector,
wherein a second conductive layer is spaced apart from the first conductive layer by an air layer,
wherein the connector portion is at least partially interposed between the second conductive layer and the circuit board base, and
wherein the second conductive layer is connected to soldering patterns on the first surface of the circuit board base.