US 12,324,286 B2
Light-emitting device
Chen-ke Hsu, Fujian (CN); Changchin Yu, Fujian (CN); Zhaowu Huang, Fujian (CN); Junpeng Shi, Fujian (CN); and Weng-Tack Wong, Fujian (CN)
Assigned to QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD, Fujian (CN)
Filed by QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD., Fujian (CN)
Filed on Apr. 1, 2024, as Appl. No. 18/623,973.
Application 18/623,973 is a continuation of application No. 17/360,956, filed on Jun. 28, 2021, granted, now 11,978,839.
Application 17/360,956 is a continuation in part of application No. PCT/CN2019/092364, filed on Jun. 21, 2019.
Application 17/360,956 is a continuation in part of application No. PCT/CN2019/092366, filed on Jun. 21, 2019.
Application 17/360,956 is a continuation in part of application No. PCT/CN2019/092368, filed on Jun. 21, 2019.
Application 17/360,956 is a continuation in part of application No. PCT/CN2019/074690, filed on Feb. 3, 2019.
Claims priority of application No. 201910108696.2 (CN), filed on Feb. 3, 2019; application No. 201910108698.1 (CN), filed on Feb. 3, 2019; and application No. 201910108701.X (CN), filed on Feb. 3, 2019.
Prior Publication US 2024/0266484 A1, Aug. 8, 2024
Int. Cl. H10H 20/856 (2025.01); H10H 20/851 (2025.01); H10H 20/853 (2025.01); H10H 20/857 (2025.01)
CPC H10H 20/856 (2025.01) [H10H 20/8515 (2025.01); H10H 20/853 (2025.01); H10H 20/857 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A light-emitting device, comprising:
a lead frame including a mounting region;
at least two light-emitting diode (LED) chips disposed on said mounting region of said lead frame, a light being emitted from each of said at least two LED chips at a light-emitting angle which is not greater than 120°, each of said at least two LED chips including
a substrate,
a semiconductor light-emitting unit disposed on a surface of said substrate and having a lower surface and an upper surface which serves as a light-emitting surface and which is opposite to said lower surface,
a first electrode and a second electrode which are disposed on said surface of said substrate,
an electrically connecting structure disposed between said semiconductor light-emitting unit and said substrate so as to permit said first electrode and said second electrode to be electrically connected to said lower surface of said semiconductor light-emitting unit through said electrically connecting structure, and
a first light-reflective layer disposed between said semiconductor light-emitting unit and said substrate, a first distance between said first light-reflective layer and said light-emitting surface of said semiconductor light-emitting unit being not greater than 10 μm; and
an encapsulant which encapsulates said at least two LED chips on said lead frame.