US 12,324,267 B2
Imaging device, electronic device, and manufacturing method
Yosuke Nitta, Kanagawa (JP); Yoshiya Hagimoto, Kanagawa (JP); Nobutoshi Fujii, Kanagawa (JP); and Yuichi Yamamoto, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/640,086
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Aug. 27, 2020, PCT No. PCT/JP2020/032282
§ 371(c)(1), (2) Date Mar. 3, 2022,
PCT Pub. No. WO2021/049302, PCT Pub. Date Mar. 18, 2021.
Claims priority of application No. 2019-164444 (JP), filed on Sep. 10, 2019.
Prior Publication US 2022/0328549 A1, Oct. 13, 2022
Int. Cl. H10F 39/00 (2025.01); H04N 25/79 (2023.01)
CPC H10F 39/809 (2025.01) [H04N 25/79 (2023.01); H10F 39/811 (2025.01); H10F 39/8053 (2025.01); H10F 39/8063 (2025.01)] 20 Claims
OG exemplary drawing
 
1. An imaging device, comprising:
a first semiconductor element including an imaging element configured to generate a pixel signal; and
a second semiconductor element in which a first signal processing circuit and a second signal processing circuit that are configured to process the pixel signal are embedded by an embedded member,
wherein the first signal processing circuit has a structure including at least one more layer than the second signal processing circuit, and
wherein a size of the second semiconductor element is larger than a size of the first semiconductor element in a plan view.