US 12,324,266 B2
Solid-state imaging device and electronic device
Ikumi Takeda, Kanagawa (JP); and Takuro Murase, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/794,051
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Dec. 2, 2020, PCT No. PCT/JP2020/044915
§ 371(c)(1), (2) Date Jul. 20, 2022,
PCT Pub. No. WO2021/157174, PCT Pub. Date Aug. 12, 2021.
Claims priority of application No. 2020-018770 (JP), filed on Feb. 6, 2020.
Prior Publication US 2023/0047442 A1, Feb. 16, 2023
Int. Cl. H01L 27/14 (2006.01); H10F 39/00 (2025.01)
CPC H10F 39/807 (2025.01) [H10F 39/8023 (2025.01); H10F 39/8057 (2025.01)] 8 Claims
OG exemplary drawing
 
1. A solid-state imaging device, comprising:
a substrate region, including an effective pixel region and a region outside of the effective pixel region, wherein the effective pixel region includes a plurality of photoelectric conversion units for obtaining a pixel signal corresponding to incident light,
wherein a plurality of first groove portions are formed between the photoelectric conversion units in the effective pixel region,
wherein the region outside of the effective pixel region is between an edge of the substrate region and the effective pixel region,
wherein the region outside of the effective pixel region includes a plurality of second groove portions, and
wherein a length of the plurality of second groove portions in a thickness direction of the substrate region in a cross-sectional view is longer than a length of the plurality of first groove portions in the thickness direction of the substrate region in the cross-sectional view.