US 12,324,136 B2
Electronic device including contact structure of camera module
Jihyun Kim, Suwon-si (KR); Kyungho Bae, Suwon-si (KR); and Yonggwan Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 15, 2023, as Appl. No. 18/184,282.
Application 18/184,282 is a continuation of application No. PCT/KR2021/012720, filed on Sep. 16, 2021.
Claims priority of application No. 10-2020-0122096 (KR), filed on Sep. 22, 2020; and application No. 10-2021-0045019 (KR), filed on Apr. 7, 2021.
Prior Publication US 2023/0292479 A1, Sep. 14, 2023
Int. Cl. H05K 9/00 (2006.01); H04M 1/02 (2006.01); H04N 23/52 (2023.01); H04N 23/57 (2023.01)
CPC H05K 9/0067 (2013.01) [H04M 1/0264 (2013.01); H04N 23/52 (2023.01); H04N 23/57 (2023.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a housing comprising a rear plate including an opening and a support bracket at least partially disposed along an edge of the rear plate;
a camera deco disposed in the opening to be exposed to an outside, the camera deco covering a camera assembly and connected to the rear plate;
a printed circuit board disposed in the housing;
a rear structure supporting the camera assembly and the printed circuit board;
a fixing member coupled to the rear structure and fixing the camera assembly and/or the printed circuit board to the support bracket; and
a conductive member at least partially disposed between the camera deco and the fixing member to electrically connect the camera deco and the fixing member.