US 12,324,115 B2
Housing of electronic device with different bonded metals and method of manufacturing the same
Yoonhee Lee, Suwon-si (KR); Youngoh Kim, Suwon-si (KR); Juncheol Shin, Suwon-si (KR); Seungchang Baek, Suwon-si (KR); Sungho Cho, Suwon-si (KR); and Hangyu Hwang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jun. 23, 2022, as Appl. No. 17/847,871.
Application 17/847,871 is a continuation of application No. PCT/KR2022/006327, filed on May 3, 2022.
Claims priority of application No. 10-2021-0074663 (KR), filed on Jun. 9, 2021.
Prior Publication US 2022/0418135 A1, Dec. 29, 2022
Int. Cl. H05K 5/04 (2006.01); B29C 45/14 (2006.01); C23C 4/06 (2016.01); C25D 11/04 (2006.01); H04M 1/02 (2006.01)
CPC H05K 5/04 (2013.01) 17 Claims
OG exemplary drawing
 
1. A housing of an electronic device, the housing comprising:
a first metal portion comprising a first metal;
a second metal portion comprising a second metal; and
a non-conductive portion,
wherein a first oxide film layer is formed on at least a portion of a surface of the first metal portion,
wherein the first oxide film layer comprises a plurality of first pores, each of the plurality of first pores having a respective first diameter in a first range,
wherein the second metal portion contacts the first metal portion,
wherein a second oxide film layer is formed on at least a portion of a surface of the second metal portion,
wherein the second oxide film layer comprises a plurality of second pores, each of the plurality of second pores having a respective second diameter in a second range, and
wherein the non-conductive portion covers at least a portion of a bonding portion between the first oxide film layer and the second oxide film layer.