US 12,324,102 B2
Semiconductor storage device including staggered semiconductor memory devices on opposed surfaces
Fu Xing Chan, Penang (MY); Chun Sean Lau, Penang (MY); and Bo Yang, Dublin, CA (US)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Jul. 17, 2023, as Appl. No. 18/222,665.
Claims priority of provisional application 63/441,370, filed on Jan. 26, 2023.
Prior Publication US 2024/0260194 A1, Aug. 1, 2024
Int. Cl. H05K 1/18 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01)
CPC H05K 1/181 (2013.01) [H01L 25/0652 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10984 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor storage device, comprising:
a printed circuit board comprising a first major surface and a second major surface opposed to the first major surface;
a first group of one or more semiconductor devices, each semiconductor device of the first group of semiconductor devices comprising a first group of solder balls, the first group of solder balls affixing the first group of semiconductor devices to the first major surface of the printed circuit board at least along a first direction; and
a second group of one or more semiconductor devices, each semiconductor device of the second group of semiconductor devices comprising a second group of solder balls, the second group of solder balls affixing the second group of semiconductor devices to the second major surface of the printed circuit board at least along the first direction;
wherein the first group of one or more semiconductor devices on the first major surface are staggered with an overlap relative to the second group of one or more semiconductor devices on the second major surface along the first direction, the staggering enabling flexing of the printed circuit board upon warping of at least one of the first and second groups of one or more semiconductor devices.