US 12,324,101 B2
Frame for coupling of a thermal management device to a printed circuit board
Gamal Refai-Ahmed, Santa Clara, CA (US); Suresh Ramalingam, Fremont, CA (US); Aslam Yehia, San Jose, CA (US); Chi-Yi Chao, New Taipei (TW); Md Malekkul Islam, San Jose, CA (US); and Hoa Do, San Jose, CA (US)
Assigned to Advanced Micro Devices, Inc., Santa Clara, CA (US)
Filed by Advanced Micro Devices, Inc., Santa Clara, CA (US)
Filed on Mar. 14, 2023, as Appl. No. 18/121,487.
Prior Publication US 2024/0314934 A1, Sep. 19, 2024
Int. Cl. H05K 1/18 (2006.01); H05K 5/00 (2006.01); H05K 7/10 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 5/0026 (2013.01); H05K 7/10 (2013.01); H05K 7/20836 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a printed circuit board (PCB);
a first chip package mounted to the PCB;
a second chip package mounted to the PCB;
a frame secured to the PCB, the frame having a first aperture disposed over the first chip package and a second aperture disposed over the second chip package; and
a plurality of thermal management devices coupled to the frame, the plurality of thermal management devices having a first thermal management device contacting an integrated circuit (IC) die of the first chip package through the first aperture, and a second thermal management device contacting an IC die of the second chip package through the second aperture.