US 12,324,097 B2
PCB pad for SMT process
Heng-Chao Chen, Taoyuan (TW); and Chia-Min Ho, Taoyuan (TW)
Assigned to DELTA ELECTRONICS, INC., Taoyuan (TW)
Filed by DELTA ELECTRONICS, INC., Taoyuan (TW)
Filed on Nov. 8, 2022, as Appl. No. 17/982,964.
Claims priority of application No. 202210989383.4 (CN), filed on Aug. 17, 2022.
Prior Publication US 2024/0064896 A1, Feb. 22, 2024
Int. Cl. H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 1/181 (2013.01); H05K 2201/10318 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB) pad for a surface mount technology (SMT) process, the PCB pad combined on a PCB, the PCB pad comprising:
an insulation body; and
a metal reflow portion, disposed on the insulation body,
wherein the metal reflow portion is located on a side of the insulation body adjacent to the PCB, and the metal reflow portion is free from electrical connection with the PCB;
wherein the metal reflow portion comprises an electroplating layer, and the electroplating layer is arranged on a bottom of the insulation body and extended to a side periphery of the insulation body;
wherein the electroplating layer is configured to enclose the side periphery of the insulation body.