US 12,324,096 B2
Structure with conductive pattern and method for manufacturing same
Tomoko Kozono, Tokyo (JP); and Toru Yumoto, Tokyo (JP)
Assigned to Asahi Kasei Kabushiki Kaisha, Tokyo (JP)
Appl. No. 17/770,303
Filed by Asahi Kasei Kabushiki Kaisha, Tokyo (JP)
PCT Filed Nov. 5, 2020, PCT No. PCT/JP2020/041415
§ 371(c)(1), (2) Date Apr. 20, 2022,
PCT Pub. No. WO2021/090893, PCT Pub. Date May 4, 2021.
Claims priority of application No. 2019-203276 (JP), filed on Nov. 8, 2019.
Prior Publication US 2022/0408558 A1, Dec. 22, 2022
Int. Cl. H05K 1/09 (2006.01); C09D 11/037 (2014.01); C09D 11/52 (2014.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 18/40 (2006.01); H01Q 1/38 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01)
CPC H05K 1/09 (2013.01) [C23C 18/165 (2013.01); C23C 18/1875 (2013.01); C23C 18/40 (2013.01); H01Q 1/38 (2013.01); H05K 1/0237 (2013.01); H05K 3/10 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A structure with an electroconductive pattern comprising a substrate, and a copper-containing electroconductive layer disposed on the surface of the substrate,
wherein, when the main surface of the electroconductive layer on the opposite side from the substrate is defined as the first main surface and the main surface on the opposite side from the first main surface is defined as the second main surface, the electroconductive layer has a porosity of 0.01 vol % to 50 vol % in the first main surface-side region that extends from the first main surface to a depth of 100 nm in the thickness direction of the electroconductive layer, and has a porosity of 10 vol % or lower in the second main surface-side region that extends from the second main surface to a depth of 100 nm in the thickness direction of the electroconductive layer, and
wherein the element ratio of oxygen atoms to copper atoms in the first main surface-side region is greater than the element ratio of oxygen atoms to copper atoms in the second main surface-side region.