US 12,324,093 B2
Single circuit board assembly with logic and power components
Ryan D. Yaklin, Chesaning, MI (US); and Piotr Karasinski, Slaskie (PL)
Assigned to Steering Solutions IP Holding Corporation, Saginaw, MI (US)
Filed by Steering Solutions IP Holding Corporation, Saginaw, MI (US)
Filed on May 25, 2022, as Appl. No. 17/824,613.
Claims priority of provisional application 63/196,832, filed on Jun. 4, 2021.
Prior Publication US 2022/0394848 A1, Dec. 8, 2022
Int. Cl. H05K 1/02 (2006.01); H02K 11/30 (2016.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0298 (2013.01) [H02K 11/30 (2016.01); H05K 1/18 (2013.01); H05K 7/209 (2013.01); H05K 2201/09518 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10545 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A single circuit board assembly for forming a vehicle-motor interface, the single circuit board assembly comprising:
a first side of a board with logic modules located thereon; a second side of the board with power modules located thereon;
wherein the board comprises a plurality of layers, the plurality of layers having at least one through via and at least one buried via defined therein, wherein the at least one through via extends through all of the plurality of layers, the at least one buried via extending through less than all of the plurality of layers; and
a heat sink assembly defining a pocket for receiving the board therein, wherein the second side of the board is adjacent to a main pocket wall of the heat sink assembly, wherein the heat sink assembly includes at least one motor mounting tab aligned and secured to at least one tab on a motor assembly housing, wherein an axial length of the motor assembly housing, the heat sink assembly and the board is less than 100 millimeters.