US 12,324,092 B2
Integrated circuit and signal transmission method
Li Chung Chang, Hsinchu (TW); Shih Min Yen, Hsinchu (TW); and Meng An Kuo, Hsinchu (TW)
Assigned to Realtek Semiconductor Corporation, Hsinchu (TW)
Filed by Realtek Semiconductor Corporation, Hsinchu (TW)
Filed on Apr. 17, 2023, as Appl. No. 18/301,273.
Claims priority of application No. 111143907 (TW), filed on Nov. 17, 2022.
Prior Publication US 2024/0172357 A1, May 23, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0245 (2013.01) [H05K 1/0219 (2013.01); H05K 1/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit, coupled to a circuit board, the circuit board comprises a plurality of signal pair channels, wherein the integrated circuit comprises:
a plurality of output terminals; and
a control circuit, coupled to the plurality of output terminals, configured to configure a plurality of output signals output to the plurality of signal pair channels by the plurality of output terminals, so that a first signal pair channel and a second signal pair channel of the plurality of signal pair channels receive and output the plurality of output signals, so that a third signal pair channel of the plurality of signal pair channels shields an interference between the first signal pair channel and the second signal pair channel, wherein the third signal pair channel is adjacent to the first signal pair channel and the second signal pair channel, and the third signal pair channel is located between the first signal pair channel and the second signal pair channel.