US 12,322,887 B2
Circuit board wafer with contacts mounted on castellated edges
Charles Raymond Gingrich, III, Mechanicsburg, PA (US); Keith Edwin Miller, Manheim, PA (US); Scott Eric Walton, Mount Joy, PA (US); and Tim Robert Chevalier, Cleona, PA (US)
Assigned to TE Connectivity Solutions GmbH, (CH)
Filed by TE Connectivity Solutions GmbH, Schaffhausen (CH)
Filed on Oct. 28, 2022, as Appl. No. 18/050,542.
Prior Publication US 2024/0145960 A1, May 2, 2024
Int. Cl. H01R 12/73 (2011.01); H01R 12/58 (2011.01); H01R 12/72 (2011.01)
CPC H01R 12/73 (2013.01) [H01R 12/585 (2013.01); H01R 12/724 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate assembly for mounting to a second substrate, the substrate assembly comprising:
a first substrate having a first surface and an oppositely facing second surface;
signal pathways provided on the first surface, the signal pathways extending to first openings extending inward from an edge of the substrate, the first openings having first walls;
first ground pathways provided on the first surface, each of the first ground pathways positioned adjacent to at least one of the signal pathways, the first ground pathways extending to second openings extending inward from the edge of the substrate, the second openings having second walls;
signal contacts mounted to the first substrate, the signal contacts having first mounting surfaces, the first mounting surfaces provide mechanical and electrical engagement with the first walls of the first openings;
ground contacts mounted to the first substrate, the ground contacts having second mounting surfaces, the second mounting surfaces provide mechanical and electrical engagement with the second walls of the second openings;
wherein mating force applied to the signal contacts and the ground contacts are transferred to the substrate.