US 12,322,856 B2
Antenna in package having antenna on package substrate
Yiqi Tang, Allen, TX (US); Makarand Ramkrishna Kulkarni, Dallas, TX (US); Liang Wan, Chengdu (CN); and Rajen Manicon Murugan, Dallas, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Dec. 30, 2020, as Appl. No. 17/138,557.
Prior Publication US 2022/0209391 A1, Jun. 30, 2022
Int. Cl. H01Q 1/22 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01P 3/08 (2006.01); H01Q 9/04 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/4871 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3185 (2013.01); H01L 23/367 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/20 (2013.01); H01L 24/48 (2013.01); H01P 3/081 (2013.01); H01Q 9/0407 (2013.01); H01L 2221/68372 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/214 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/19032 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An antenna in package (AIP), comprising:
a top side package substrate including a top metal layer including an antenna and a bottom metal layer separated from the top metal layer by a dielectric layer that includes filled vias, the bottom metal layer including a plurality of contact pads including a first contact pad and a second contact pad;
an integrated circuit (IC) die comprising a substrate including a top side semiconductor surface including a plurality of bond pads thereon;
a bottom side package substrate including a bottom side, and a top side having a plurality of metal pads including a first metal pad and a second metal pad, the first metal pad for electrically coupling to vertical connectors, and the second metal pad for electrically coupling to the plurality of bond pads; and
the vertical connectors including at least a first vertical connector attached via solder to the first metal pad, and attached to the first contact pad without solder.