| CPC H01L 25/167 (2013.01) [H01L 23/3121 (2013.01); H01L 23/34 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H04R 1/1016 (2013.01); H04R 1/1041 (2013.01); H04R 1/1075 (2013.01); H04R 29/001 (2013.01); G01C 3/08 (2013.01); G01J 5/12 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H04R 1/023 (2013.01)] | 5 Claims |

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1. A semiconductor package, comprising:
a substrate;
a temperature module disposed on the substrate;
a first light absorbing material in direct contact with a first portion of the temperature module;
a transparent material in direct contact with a second portion of the temperature module different from the first portion;
a second light absorbing material in direct contact with a third portion of the temperature module different from the first portion and the second portion; and
a light emitter and a light receiver disposed on the substrate,
wherein the first light absorbing material is in direct contact with the transparent material,
wherein the first light absorbing material has a top surface and a lateral surface, both of which are in contact with the transparent material,
wherein the second light absorbing material is separated and spaced apart from the first light absorbing material, and wherein, in a cross-sectional view, the first light absorbing material is higher than the second light absorbing material with respect to the temperature module,
wherein a width of the first portion is different from a width of the third portion,
wherein a first volume of the first light absorbing material is different from a second volume of the second light absorbing material, and
wherein the first volume is larger than the second volume, and wherein the first light absorbing material is adjacent to the light emitter and the second light absorbing material is adjacent to the light receiver.
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