US 12,322,729 B2
Semiconductor device
Weiming Chris Chen, Taipei (TW); Tu-Hao Yu, Hsin-Chu (TW); Kuo-Chiang Ting, Hsinchu (TW); Shang-Yun Hou, Hsinchu (TW); and Chi-Hsi Wu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Nov. 20, 2022, as Appl. No. 18/057,222.
Application 18/057,222 is a division of application No. 16/716,225, filed on Dec. 16, 2019, granted, now 11,508,696.
Application 16/716,225 is a division of application No. 15/725,240, filed on Oct. 4, 2017, granted, now 10,510,722, issued on Dec. 17, 2019.
Claims priority of provisional application 62/522,474, filed on Jun. 20, 2017.
Prior Publication US 2023/0085054 A1, Mar. 16, 2023
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2023.01); H10D 1/68 (2025.01)
CPC H01L 25/0657 (2013.01) [H01L 23/49833 (2013.01); H01L 23/50 (2013.01); H01L 23/5386 (2013.01); H01L 24/03 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 23/13 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19104 (2013.01); H10D 1/716 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a first electronic component having a first surface and a second surface opposite to the first surface, wherein the first electronic component comprises a plurality of electrical terminals disposed over the first surface;
a second electronic component having a first surface facing the first electronic component and a second surface opposite to the first surface;
a third electronic component having a first surface facing the second electronic component and a second surface opposite to the first surface, wherein the first electronic component is between the second electronic component and the third electronic component;
a plurality of first interconnection structures between the first surface of the first electronic component and the first surface of the second electronic component, and electrically connected to the first electronic component and the second electronic component, wherein each of the first interconnection structures has a length along a first direction substantially parallel to the first surface of the first electronic component and a width along a second direction substantially parallel to the first surface of the first electronic component and substantially perpendicular to the first direction, and the length is larger than the width; and
a plurality of second interconnection structures between the first surface of the second electronic component and the first surface of the third electronic component, and electrically connected to the second electronic component and the third electronic component,
wherein each of the first interconnection structures is electrically connected to two or more of the plurality of electrical terminals of the first electronic component,
wherein a height of each of the second interconnection structures is different from a height of each of the first interconnection structures, the width of each first interconnection structure is consistent from a top view, and the height of each of the first interconnection structures is consistent,
wherein the first interconnection structures comprises a first set of and a second set, the first set and the second set are arranged alternately in the second direction, the first interconnection structures of the first set are electrically connected, the first interconnection structures of the second set are electrically connected, and the first set and the second set are electrically disconnected from each other.