US 12,322,718 B2
Bonded structure with interconnect structure
Belgacem Haba, Saratoga, CA (US)
Assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed by ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed on Aug. 17, 2023, as Appl. No. 18/451,388.
Application 18/451,388 is a continuation of application No. 17/171,531, filed on Feb. 9, 2021, granted, now 11,764,177.
Claims priority of provisional application 63/074,928, filed on Sep. 4, 2020.
Prior Publication US 2024/0234353 A1, Jul. 11, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/52 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 29/40 (2006.01)
CPC H01L 24/08 (2013.01) [H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 24/05 (2013.01); H01L 24/80 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/08235 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A method of manufacturing a bonded structure, the method comprising:
providing a routing structure having conductors at least partially embedded in a non-conductive material and an upper surface, the upper surface comprising a first conductive pad, a second conductive pad, and a non-conductive region, wherein providing the routing structure comprises forming the routing structure on a carrier;
directly bonding a first die comprising integrated circuitry to the routing structure, the first die having a first bonding surface, the first bonding surface comprising a first conductive bond pad and a first non-conductive material, the first conductive bond pad directly bonded to the first conductive pad without an intervening adhesive, and the first non-conductive material directly bonded to a first portion of the non-conductive region;
removing the carrier from the routing structure after directly bonding the first die to the routing structure;
directly bonding a second die comprising integrated circuitry to the routing structure, the second die spaced apart from the first die laterally along the upper surface of the routing structure, the second die electrically connected with the first die through at least the routing structure;
forming a dielectric layer over at least a portion of the upper surface of the routing structure;
disposing an encapsulant over at least a portion of the dielectric layer; and
providing a support structure over the encapsulant and the first and second dies.