| CPC H01L 23/5227 (2013.01) [H01F 17/0013 (2013.01); H01F 41/041 (2013.01); H01L 23/5283 (2013.01)] | 19 Claims |

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1. A structure comprising a plurality of wiring levels each of which comprise a wiring structure, a second wiring level being located above a first wiring level of the plurality of wiring levels, wherein a top portion of a wiring structure of the first wiring level is in direct physical contact with a bottom surface of the wiring structure of the second wiring level with the direct physical contact between the top portion of the wiring structure of the first wiring level and the bottom surface of the wiring structure of the second wiring level being devoid of any via interconnects.
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