| CPC H01L 23/49822 (2013.01) [H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 2221/68345 (2013.01)] | 11 Claims |
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1. A package structure, comprising:
a glass substrate;
a redistribution layer structure disposed on the glass substrate; and
an electronic component disposed on the redistribution layer structure,
wherein the redistribution layer structure comprising:
a first metal layer disposed on the glass substrate;
a first dielectric layer disposed on the first metal layer;
a second metal layer disposed on the first dielectric layer;
a second dielectric layer disposed on the second metal layer;
a third metal layer disposed on the second dielectric layer;
a third dielectric layer disposed on the third metal layer;
a fourth metal layer disposed on the third dielectric layer; and
a fourth dielectric layer disposed on the fourth metal layer,
wherein, a coefficient of thermal expansion of the first dielectric layer is less than a coefficient of thermal expansion of the second dielectric layer, the coefficient of thermal expansion of the second dielectric layer is less than a coefficient of thermal expansion of the third dielectric layer, and the coefficient of thermal expansion of the third dielectric layer is less than a coefficient of thermal expansion of the fourth dielectric layer,
wherein a thickness of the first dielectric layer is greater than a thickness of the second dielectric layer, and the thickness of the second dielectric layer is greater than a thickness of the third dielectric layer.
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