US 12,322,684 B2
Method of manufacturing electronic devices and corresponding electronic device
Roberto Tiziani, Nerviano (IT); and Laurent Herard, Saint Foy les Lyon (FR)
Assigned to STMicroelectronics S.r.l., Agrate Brianza (IT); and STMicroelectronics Pte Ltd, Singapore (SG)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT); and STMicroelectronics Pte Ltd, Singapore (SG)
Filed on Apr. 26, 2022, as Appl. No. 17/729,452.
Claims priority of application No. 102021000011096 (IT), filed on Apr. 30, 2021.
Prior Publication US 2022/0352057 A1, Nov. 3, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01)
CPC H01L 23/49811 (2013.01) [H01L 21/4853 (2013.01); H01L 23/13 (2013.01); H01L 23/49838 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method, comprising:
providing a plurality of substrates having electrically-conductive tracks;
arranging a semiconductor chip on each substrate and electrically coupling the semiconductor chip to selected ones of said electrically-conductive tracks;
attaching said plurality of substrates onto a common base plate;
then providing containment structures at selected locations on said electrically-conductive tracks, wherein said containment structures have respective perimeter walls which define cavities having a size and shape configured to respectively accommodate a base portion of pin holders; and
soldering said pin holders within said cavities defined by said containment structures on said electrically-conductive tracks.