US 12,322,670 B2
Methods and apparatus for package with interposers
Chun-Lin Lu, Hsinchu (TW); Kai-Chiang Wu, Hsinchu (TW); Yen-Ping Wang, Hemei Township (TW); Shih-Wei Liang, Dajia Township (TW); and Ching-Feng Yang, Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Aug. 31, 2021, as Appl. No. 17/462,115.
Application 16/588,504 is a division of application No. 15/958,949, filed on Apr. 20, 2018, granted, now 10,522,437, issued on Dec. 31, 2019.
Application 15/335,260 is a division of application No. 13/706,593, filed on Dec. 6, 2012, granted, now 9,497,861, issued on Nov. 15, 2016.
Application 17/462,115 is a continuation of application No. 16/588,504, filed on Sep. 30, 2019, granted, now 11,114,357.
Application 15/958,949 is a continuation of application No. 15/335,260, filed on Oct. 26, 2016, granted, now 9,966,321, issued on May 8, 2018.
Prior Publication US 2021/0391230 A1, Dec. 16, 2021
Int. Cl. H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/24 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/24 (2013.01) [H01L 21/481 (2013.01); H01L 21/4885 (2013.01); H01L 21/563 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 25/105 (2013.01); H05K 1/181 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/18161 (2013.01); H05K 2201/049 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/2036 (2013.01); Y02P 70/50 (2015.11)] 20 Claims
OG exemplary drawing
 
1. A structure comprising:
a substrate, the substrate comprising a die attach region, an underfill region, and a connect region, wherein the underfill region includes the die attach region and an area surrounding the die attach region, and wherein the connect region is disposed outside the underfill region, the substrate comprising a conductive feature;
a first contact pad and a second contact pad, wherein the first contact pad is disposed within the die attach region, wherein the second contact pad is disposed in the connect region;
a first dam over the substrate, the first dam comprising a first layer of conductive material directly contacting the conductive feature, wherein the first dam is disposed around the underfill region;
a die attached to the first contact pad of the die attach region by a first connector, wherein the first dam is isolated from circuitry of the die; and
a package device attached to the second contact pad by a second connector, the package device having a bottom surface that simultaneously contacts a top surface of the die and a top surface of the first dam.