US 12,322,656 B2
Substrate laser processing method and substrate laser processing apparatus
Yohei Yamashita, Kumamoto (JP); Hayato Tanoue, Kumamoto (JP); and Yasutaka Mizomoto, Kumamoto (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 17/788,776
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Dec. 9, 2020, PCT No. PCT/JP2020/045884
§ 371(c)(1), (2) Date Jun. 24, 2022,
PCT Pub. No. WO2021/131711, PCT Pub. Date Jul. 1, 2021.
Claims priority of application No. 2019-236190 (JP), filed on Dec. 26, 2019; and application No. 2020-011824 (JP), filed on Jan. 28, 2020.
Prior Publication US 2023/0023577 A1, Jan. 26, 2023
Int. Cl. H01L 21/78 (2006.01); H01L 21/268 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/7806 (2013.01) [H01L 21/268 (2013.01); H01L 21/67115 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A substrate processing method of transferring, in a combined substrate in which a first substrate and a second substrate are bonded to each other, a device layer formed on a surface of the second substrate to the first substrate,
wherein a laser beam is radiated in a pulse shape from a rear surface side of the second substrate to a laser absorption layer formed between the second substrate and the device layer,
wherein the laser beam is radiated to an outer peripheral portion of the laser absorption layer while the combined substrate is rotated, and
wherein a central portion on an inner side of the outer peripheral portion of the laser absorption layer in a diametrical direction is scanned with the laser beam in a state where rotation of the combined substrate is stopped.