US 12,322,650 B2
Diffusion barrier for interconnects
Rajesh Katkar, Milpitas, CA (US); and Cyprian Emeka Uzoh, San Jose, CA (US)
Assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed by ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed on Sep. 3, 2024, as Appl. No. 18/822,980.
Application 18/822,980 is a continuation of application No. 18/297,829, filed on Apr. 10, 2023, granted, now 12,198,981.
Application 18/297,829 is a continuation of application No. 17/313,185, filed on May 6, 2021, granted, now 11,694,925, issued on Jul. 4, 2023.
Application 17/313,185 is a continuation of application No. 16/143,850, filed on Sep. 27, 2018, granted, now 11,031,285, issued on Jun. 8, 2021.
Claims priority of provisional application 62/569,232, filed on Oct. 6, 2017.
Prior Publication US 2024/0429094 A1, Dec. 26, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/768 (2006.01); H01L 21/68 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 21/76843 (2013.01) [H01L 21/68 (2013.01); H01L 23/53238 (2013.01); H01L 24/09 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/08237 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/37001 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A bonded structure comprising:
a first substrate having a first bonding surface, the first substrate comprising:
a first insulating layer having an upper surface extending parallel to a the first bonding surface;
an embedded barrier layer disposed on and extending parallel to the first insulating layer without extending below the upper surface of the first insulating layer;
a second insulating layer disposed on and extending parallel to the embedded barrier layer, an upper surface of the second insulating layer forming part of the first bonding surface; and
a first contact pad extending through the second insulating layer, through the embedded barrier layer, and at least partially through the first insulating layer, and
a second substrate having a second bonding surface, the second substrate including an insulating material and a second contact pad,
wherein the first bonding surface is directly bonded to the second bonding surface, and the first contact pad is directly bonded to the second contact pad, at a bonding interface without an intervening adhesive.