US 12,322,638 B2
Processing apparatus
Yoshinori Kakinuma, Tokyo (JP); Yoshinobu Saito, Tokyo (JP); Yukiyasu Masuda, Tokyo (JP); Toshiyuki Yoshikawa, Tokyo (JP); Toshio Tsuchiya, Tokyo (JP); Masanobu Takenaka, Tokyo (JP); and Tomoyuki Hongo, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Feb. 15, 2022, as Appl. No. 17/651,104.
Claims priority of application No. 2021-026093 (JP), filed on Feb. 22, 2021.
Prior Publication US 2022/0270910 A1, Aug. 25, 2022
Int. Cl. H01L 21/683 (2006.01); B23K 26/364 (2014.01); B23K 26/402 (2014.01); B23K 103/00 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/6836 (2013.01) [B23K 26/364 (2015.10); B23K 26/402 (2013.01); H01L 21/67775 (2013.01); B23K 2103/56 (2018.08)] 3 Claims
OG exemplary drawing
 
1. A processing apparatus that removes a ring-shaped reinforcing part with a projection shape from a wafer in which the ring-shaped reinforcing part is formed into the projection shape on a back surface corresponding to an outer circumferential surplus region, the processing apparatus comprising:
a wafer cassette table on which a wafer cassette in which a plurality of wafers are housed is placed;
a wafer carrying-out unit that carries out the wafer from the wafer cassette placed on the wafer cassette table;
a wafer table that supports a front surface side of the wafer carried out by the wafer carrying-out unit;
a frame housing unit that houses a plurality of annular frames in which an opening part that houses the wafer is formed;
a frame carrying-out unit that carries out the annular frame from the frame housing unit;
a frame table that supports the annular frame carried out by the frame carrying-out unit;
a tape sticking unit that is disposed over the frame table and sticks a tape to the annular frame;
a tape-attached frame conveying unit that conveys the annular frame to which the tape is stuck to the wafer table, and positions the opening part of the annular frame to the back surface of the wafer supported by the wafer table, and places a tape-attached frame on the wafer table;
a tape pressure bonding unit that executes pressure bonding of the tape of the tape-attached frame to the back surface of the wafer;
frame unit carrying-out means that carries out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure-bonded by the tape pressure bonding unit from the wafer table;
a reinforcing part removing unit that cuts and removes the ring-shaped reinforcing part from the wafer of the frame unit carried out by the frame unit carrying-out means;
ring-free unit carrying-out means that carries out a ring-free unit resulting from the removal of the ring-shaped reinforcing part from the reinforcing part removing unit; and
a frame cassette table on which a frame cassette that houses the ring-free unit carried out by the ring-free unit carrying-out means is placed, wherein
the reinforcing part removing unit includes
a removal detecting unit that detects whether or not the ring-shaped reinforcing part has been removed.