US 12,322,634 B2
Electrostatic chuck prepared by additive manufacturing, and related methods and structures
Chandra Venkatraman, Tyngsboro, MA (US); Scott Sirignano, Azle, TX (US); Yan Liu, Lexington, MA (US); Subhash Guddati, Singapore (SG); Thines Kumar Perumal, Singapore (SG); Montray Leavy, Singapore (SG); Jakub Rybczynski, Arlington, MA (US); and Carlo Waldfried, Middleton, MA (US)
Assigned to ENTEGRIS, INC., Billerica, MA (US)
Filed by ENTEGRIS, INC., Billerica, MA (US)
Filed on Dec. 21, 2021, as Appl. No. 17/558,381.
Claims priority of provisional application 63/132,634, filed on Dec. 31, 2020.
Prior Publication US 2022/0208592 A1, Jun. 30, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01T 23/00 (2006.01); H01L 21/683 (2006.01); B22F 10/28 (2021.01); H02N 13/00 (2006.01)
CPC H01L 21/6833 (2013.01) [B22F 10/28 (2021.01); H02N 13/00 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A chuck base comprising:
an upper chuck base surface made of an inorganic composite,
a lower chuck base surface made of the inorganic composite,
an interior portion between the upper chuck base surface and the lower chuck base surface, made of the inorganic composite, and
channels within the interior portion, formed by the inorganic composite, the upper chuck base surface, the lower chuck base surface, and the interior portion including a continuous layer of the inorganic composite that extends from the upper chuck base surface to the lower chuck base surface,
wherein at least one of the upper chuck base surface and the lower chuck base surface has a surface roughness that is less than 50 microns.