US 12,322,623 B2
Semiconductor die carrier structure
Tzu-Chung Tsai, Hsinchu (TW); Ping-Cheng Ko, Hsinchu (TW); Fang-Yu Liu, Hsinchu (TW); and Jhih-Yuan Yang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Nov. 20, 2023, as Appl. No. 18/514,268.
Application 18/514,268 is a division of application No. 17/216,247, filed on Mar. 29, 2021, granted, now 11,881,421.
Application 17/216,247 is a division of application No. 16/448,467, filed on Jun. 21, 2019, granted, now 10,964,569, issued on Mar. 30, 2021.
Claims priority of provisional application 62/692,357, filed on Jun. 29, 2018.
Prior Publication US 2024/0087932 A1, Mar. 14, 2024
Int. Cl. H01L 21/673 (2006.01); B29C 35/16 (2006.01); B29C 45/72 (2006.01); B29C 45/73 (2006.01); B29C 45/74 (2006.01); B29C 45/78 (2006.01); B29K 69/00 (2006.01); B29L 31/00 (2006.01)
CPC H01L 21/67386 (2013.01) [B29C 45/7207 (2013.01); B29C 45/73 (2013.01); B29C 45/74 (2013.01); B29C 45/78 (2013.01); H01L 21/67356 (2013.01); H01L 21/67366 (2013.01); H01L 21/67369 (2013.01); H01L 21/67373 (2013.01); H01L 21/67379 (2013.01); H01L 21/67396 (2013.01); B29C 2035/1616 (2013.01); B29C 2945/76531 (2013.01); B29C 2945/76668 (2013.01); B29C 2945/76688 (2013.01); B29C 2945/76765 (2013.01); B29K 2069/00 (2013.01); B29L 2031/712 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
storing a semiconductor device in an apparatus, wherein the apparatus comprises:
a first portion, comprising:
a first front wall;
a first rear wall; and
a bottom wall integrally coupled to the first front wall and the first rear wall, wherein at least one pivotal pin structure is integrally coupled to and extends from the first rear wall, wherein the at least one pivotal pin structure comprises a base support and a shaft protruding from the base support, and wherein top surfaces of the base support and the shaft are coplanar and parallel to the bottom wall; and
a second portion, comprising:
a second front wall;
a second rear wall; and
a top wall integrally coupled to the second front wall and the second rear wall, wherein at least one pin holder is integrally coupled to and extends from the second rear wall and configured to receive the at least one pivotal pin structure into the at least one pin holder such that the first and second portions of the apparatus are pivotally movable between an open configuration and a closed configuration; and
transporting the apparatus from a first location to a second location with the semiconductor device stored therein.