US 12,322,619 B2
Dynamic process control in semiconductor manufacturing
Purushottam Kumar, Hillsboro, OR (US); Tengfei Miao, San Jose, CA (US); Gengwei Jiang, Tigard, OR (US); Daniel Ho, Camas, WA (US); Joseph R. Abel, West Linn, OR (US); Siddappa Attur, Beaverton, OR (US); and Pulkit Agarwal, Beaverton, OR (US)
Assigned to Lam Research Corporation, Fremont, CA (US)
Appl. No. 17/634,214
Filed by Lam Research Corporation, Fremont, CA (US)
PCT Filed Aug. 11, 2020, PCT No. PCT/US2020/045794
§ 371(c)(1), (2) Date Feb. 9, 2022,
PCT Pub. No. WO2021/030364, PCT Pub. Date Feb. 18, 2021.
Claims priority of provisional application 62/885,667, filed on Aug. 12, 2019.
Prior Publication US 2022/0293442 A1, Sep. 15, 2022
Int. Cl. H01L 21/67 (2006.01); G05B 19/418 (2006.01)
CPC H01L 21/67253 (2013.01) [G05B 19/41875 (2013.01); G05B 2219/32368 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A system for monitoring processing cycles in a manufacturing process, the system comprising:
a processing chamber for the manufacturing process; and
one or more controllers configured to perform process monitoring operations, the operations comprising:
identifying a parameter of the manufacturing process; and
generating a first curve of parameter values including a first parameter value based on a first cycle of the manufacturing process, the parameter values including a gas line charge time for a line supplying the processing chamber.