US 12,322,611 B2
Semiconductor manufacturing device and method of using the same
Keiji Nakagawa, Kanazawa Ishikawa (JP)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (JP); and Toshiba Electronic Devices & Storage Corporation, Tokyo (JP)
Filed by KABUSHIKI KAISHA TOSHIBA, Tokyo (JP); and TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo (JP)
Filed on Mar. 7, 2022, as Appl. No. 17/688,103.
Claims priority of application No. 2021-154480 (JP), filed on Sep. 22, 2021.
Prior Publication US 2023/0093400 A1, Mar. 23, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01)
CPC H01L 21/67092 (2013.01) [H01L 21/6836 (2013.01); H01L 21/78 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing device comprising:
a table having an upper face on which a frame having a first opening to which a substrate is fixed by an adhesive is disposed,
the table having
a plurality of first through holes penetrating the table in a vertical direction and provided side by side in a first direction parallel to the upper face and
a plurality of second through holes each provided between the adjacent first through holes and penetrating the table in the vertical direction; and
a container provided on the table,
the container including
a first sidewall provided on the frame,
a second sidewall provided on the frame, the second sidewall facing the first sidewall, a distance between the second sidewall and the first sidewall being larger than a first inner diameter of the first opening, and
a joint allowing an outside of the container and an inside of the container to communicate with each other.