US 12,322,609 B2
Substrate processing apparatus and substrate processing method
Kohei Sato, Tokyo (JP); and Hiroki Takahashi, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Dec. 22, 2022, as Appl. No. 18/087,619.
Claims priority of application No. 2021-214690 (JP), filed on Dec. 28, 2021.
Prior Publication US 2023/0207339 A1, Jun. 29, 2023
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67051 (2013.01) [H01L 21/67248 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a first module used in a substrate processing process;
a second module used in a substrate processing process after the first module;
a nozzle provided in the second module and configured to supply a target treatment liquid;
a temperature detector that detects a temperature of a treatment liquid inside the nozzle or a temperature of the nozzle;
a substrate detection sensor that detects a position of a substrate, the substrate detection sensor including a first substrate detection sensor that detects presence or absence of the substrate in the first module; and
a controller configured to control discharge of the target treatment liquid from the nozzle in the second module according to the temperature of the treatment liquid detected by the temperature detector and a signal indicating that the first detection sensor detects the substrate.