US 12,322,607 B2
Wafer processing apparatus and wafer processing method
Seung Dae Baek, Hwaseong-si (KR); Kuem Dong Heo, Ansan-si (KR); Kang Won Lee, Guri-si (KR); and Woon Kong, Cheonan-si (KR)
Assigned to ZEUS CO., LTD., Hwaseong-si (KR)
Filed by ZEUS CO., LTD., Hwaseong-si (KR)
Filed on Apr. 20, 2022, as Appl. No. 17/725,054.
Claims priority of application No. 10-2021-0051544 (KR), filed on Apr. 21, 2021.
Prior Publication US 2022/0344177 A1, Oct. 27, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67051 (2013.01) [H01L 21/6708 (2013.01); H01L 21/687 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wafer processing apparatus comprising:
a suction nozzle that suctions sludge from a cup housing;
a flow line connected to the suction nozzle such that the sludge and a chemical solution flow therein;
a suction tank connected to the flow line such that the sludge and the chemical solution flow thereto; and
an ejector installed on a flow line and that generates suction pressure in the suction nozzle and the flow line, wherein
the suction tank includes:
a suction tank body; and
a filter disposed inside the suction tank body and that filters the sludge discharged from the flowline.