US 12,322,604 B2
Method for manufacturing an electronic power module using polymer preforms
Baptiste Joël Christian Fedi, Moissy-Cramayel (FR); Rabih Khazaka, Moissy-Cramayel (FR); Toni Youssef, Moissy-Cramayel (FR); and Pierre Jean Sallot, Moissy-Cramayel (FR)
Assigned to SAFRAN, Paris (FR)
Appl. No. 17/609,596
Filed by SAFRAN, Paris (FR)
PCT Filed Apr. 24, 2020, PCT No. PCT/FR2020/050709
§ 371(c)(1), (2) Date Nov. 8, 2021,
PCT Pub. No. WO2020/225499, PCT Pub. Date Nov. 12, 2020.
Claims priority of application No. 1904735 (FR), filed on May 6, 2019.
Prior Publication US 2022/0230891 A1, Jul. 21, 2022
Int. Cl. H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); H01L 23/00 (2006.01)
CPC H01L 21/4857 (2013.01) [H01L 23/3675 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); H01L 24/48 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/3512 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for manufacturing a power electronic module (1) by additive manufacturing, characterized in that it comprises the steps of:
making or fixing preforms (15) of polymer material on at least one face of a metallized substrate (2) comprising an insulating substrate (2a) covered with at least one layer of metal (2b, 2c),
depositing a first metal layer (17) on the preform (15),
depositing by electroforming a second metal layer (18) on the first metal layer (17), and
dissolving the preforms of polymeric material (15) by chemical or thermal means.