US 12,322,586 B2
Substrate cleaning method and substrate processing method
Koji Nishiyama, Kyoto (JP)
Assigned to SCREEN HOLDINGS CO., LTD., (JP)
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
Filed on Apr. 27, 2023, as Appl. No. 18/308,368.
Application 18/308,368 is a division of application No. 17/206,238, filed on Mar. 19, 2021, granted, now 11,676,811.
Application 17/206,238 is a division of application No. 16/351,846, filed on Mar. 13, 2019, granted, now 10,985,008, issued on Apr. 20, 2021.
Application 16/351,846 is a division of application No. 15/398,119, filed on Jan. 4, 2017, granted, now 10,276,365, issued on Apr. 30, 2019.
Claims priority of application No. 2016-017464 (JP), filed on Feb. 1, 2016; and application No. 2016-175300 (JP), filed on Sep. 8, 2016.
Prior Publication US 2023/0268174 A1, Aug. 24, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/02 (2006.01); B08B 1/00 (2006.01); B08B 1/12 (2024.01); B08B 1/20 (2024.01); B08B 3/02 (2006.01); B08B 7/04 (2006.01); B08B 11/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/0209 (2013.01) [B08B 1/00 (2013.01); B08B 1/12 (2024.01); B08B 1/20 (2024.01); B08B 3/022 (2013.01); B08B 7/04 (2013.01); B08B 11/02 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); H01L 21/68728 (2013.01); H01L 21/68742 (2013.01); H01L 21/68764 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A substrate cleaning method for cleaning a back surface of a substrate including:
holding and rotating the substrate by a rotation holder; and
cleaning the back surface of the substrate held by the rotation holder, wherein
the holding and rotating the substrate includes:
holding the substrate by a holder provided at a rotator, and
rotating the rotator about a rotation axis,
a rotation center of the substrate coincides with a rotation center of the rotator, and the cleaning includes:
moving a cleaning tool by a mover while pressing the cleaning tool against the back surface of the substrate held by the holder,
removing foreign matter on the back surface of the substrate by polishing with the cleaning tool, and
further cleaning the back surface of the substrate, which has been cleaned or is being cleaned by the cleaning tool, by a cleaning brush.