| CPC H01J 37/32871 (2013.01) [H01J 37/321 (2013.01); H01J 37/3211 (2013.01); H01J 37/32119 (2013.01); H01J 37/32449 (2013.01); H01J 37/32651 (2013.01); H01L 21/67069 (2013.01); H01J 2237/334 (2013.01); H01L 21/6831 (2013.01)] | 12 Claims |

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1. A substrate processing system, comprising:
a processing chamber including a substrate support to support a substrate;
an inner coil including a first conductor including first terminals and a second conductor including second terminals;
an outer coil including a third conductor including third terminals and a fourth conductor including fourth terminals;
an RF source configured to supply RF power to the inner and outer coils;
a dielectric window arranged on one surface of the processing chamber adjacent to the inner and outer coils; and
a plurality of contamination reducers for reducing contamination of the substrate, including:
a first plate arranged between the dielectric window and a first one of the third terminals of the third conductor, and a first one of the fourth terminals of the fourth conductor,
a second plate arranged between the dielectric window and a first one of the first terminals of the first conductor;
a third plate arranged between the dielectric window and a second one of the third terminals of the third conductor, and a second one of the fourth terminals of the fourth conductor, and
a fourth plate arranged between the dielectric window and the second terminals of the second conductor; wherein each of the first plate, the second plate, the third plate and the fourth plate have a rectangular shape.
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