| CPC H01J 37/3177 (2013.01) [G03F 7/70383 (2013.01); G06F 30/392 (2020.01); G06F 30/394 (2020.01); H01J 37/3174 (2013.01); H01L 21/027 (2013.01); H01L 21/0274 (2013.01); H01L 21/0277 (2013.01); H01L 21/76816 (2013.01); H01L 23/573 (2013.01); G06F 2115/02 (2020.01); G06F 2119/18 (2020.01); H01J 2237/31764 (2013.01)] | 20 Claims |

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1. An electronic device, which is a member of a set of semiconductor chips, comprising:
a common design layout part that is the same for all of the semiconductor chips of the set; and
a non-common design layout part that is the same for only a subset of the semiconductor chips of the set,
wherein the common design layout part and the non-common design layout part are formed in a plurality of layers, and
wherein the non-common design layout part includes at least one of: connections between a metal layer and a gate in a contact layer of the plurality of layers, or a P- or N-doped active region of a transistor of one of the plurality of layers.
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