US 12,322,557 B2
Electronic component and board having the same mounted thereon
Ki Young Kim, Suwon-si (KR); Jae Young Na, Suwon-si (KR); Beom Joon Cho, Suwon-si (KR); Ji Hong Jo, Suwon-si (KR); and Woo Chul Shin, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 2, 2022, as Appl. No. 17/734,355.
Application 17/734,355 is a continuation of application No. 16/914,942, filed on Jun. 29, 2020, granted, now 11,355,288.
Claims priority of application No. 10-2019-0115004 (KR), filed on Sep. 18, 2019.
Prior Publication US 2022/0262573 A1, Aug. 18, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/005 (2006.01); H01G 4/228 (2006.01); H01G 4/30 (2006.01); H01G 4/38 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H01G 4/385 (2013.01) [H01G 4/005 (2013.01); H01G 4/228 (2013.01); H01G 4/30 (2013.01); H05K 1/11 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a multilayer capacitor, the multilayer capacitor including a body, and first and second external electrodes, wherein the first and second external electrodes include first and second head portions disposed on both surfaces of the body opposing in a first direction, respectively, and first and second band portions extending from the first and second head portions to a portion of a lower surface of the body, respectively;
a first metal frame including a first support portion attached to the first band portion, a first mounting portion located lower than a lowermost portion of the first external electrode in a third direction perpendicular to the first direction, and a first connection portion connecting the first support portion to the first mounting portion, the first mounting portion being spaced apart from the first head portion and away from the body in the first direction;
a second metal frame including a second support portion attached to the second band portion, a second mounting portion located lower than a lowermost portion of the second external electrode in the third direction, and a second connection portion connecting the second support portion to the second mounting portion, the second mounting portion being spaced apart from the second head portion and away from the body in the first direction; and
a capsule portion encapsulating the multilayer capacitor to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame,
wherein the first connection portion includes a first extension portion extending upwardly from an end of the first mounting portion proximate to the body, a third extension portion extending upwardly from the first support portion and spaced apart from the first head portion and away from the body in the first direction, and a second extension portion connecting the first extension portion and the third extension portion in the first direction wherein the second connection portion includes a fourth extension portion extending upwardly from an end of the second mounting portion proximate to the body, a sixth extension portion extending upwardly from the second support portion and spaced apart from the second head portion and away from the body in the first direction, and a fifth extension portion connecting the fourth extension portion and the sixth extension portion in the first direction, and
wherein the first extension portion and the fourth extension portion are apart from the capsule portion.