	US 12,322,556 B2
	Multilayer electronic component
Mun Seong Jeong, Suwon-si (KR); Jung Min Kim, Suwon-si (KR); Jin Kyung Park, Suwon-si (KR); Chang Soo Jang, Suwon-si (KR); Su Ji Kang, Suwon-si (KR); and Na Young Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Feb. 2, 2023, as Appl. No. 18/104,928.
Claims priority of application No. 10-2022-0149742 (KR), filed on Nov. 10, 2022.
Prior Publication US 2024/0161981 A1, May 16, 2024
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01)

CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01)]

15 Claims

1. A multilayer electronic component comprising:

a body including a capacitance forming portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction and a cover portion disposed on one surface and other surface of the capacitance forming portion in the first direction; and

external electrodes disposed on the body,

wherein a secondary phase including aluminum (Al) is disposed at a part of an interface between an internal electrode of the internal electrodes and the dielectric layer, and

a ratio of an area occupied by the secondary phase to an area of the capacitance forming portion is 0.03% or more and 0.4% or less.