| CPC G11C 11/1675 (2013.01) [G01R 33/093 (2013.01); G11C 11/161 (2013.01); H10B 61/22 (2023.02); H10N 50/10 (2023.02); H10N 50/85 (2023.02); H10N 52/01 (2023.02); H10N 52/80 (2023.02)] | 19 Claims |

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1. A device comprising:
a first metal interconnection and a second metal interconnection on a substrate;
a first inter-metal dielectric layer (IMD) around the first metal interconnection and the second metal interconnection;
a channel layer on the first IMD layer, the first metal interconnection, and the second metal interconnection, wherein the channel layer is a spin-orbital-transfer (SOT) layer; and
a magnetic tunneling junction (MTJ) on the channel layer.
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