US 12,321,803 B2
RFID tag
Takuro Shimada, Kagawa (JP); Ryota Kondo, Ehime (JP); Taro Ikawa, Ehime (JP); and Daiji Matsunoshita, Kanagawa (JP)
Assigned to DAIO PAPER CORPORATION, Ehime (JP)
Appl. No. 17/756,007
Filed by DAIO PAPER CORPORATION, Ehime (JP)
PCT Filed Nov. 11, 2020, PCT No. PCT/JP2020/042125
§ 371(c)(1), (2) Date May 13, 2022,
PCT Pub. No. WO2021/100576, PCT Pub. Date May 27, 2021.
Claims priority of application No. 2019-209103 (JP), filed on Nov. 19, 2019.
Prior Publication US 2022/0391658 A1, Dec. 8, 2022
Int. Cl. G06K 19/077 (2006.01); H01Q 1/38 (2006.01); H01Q 7/00 (2006.01)
CPC G06K 19/07775 (2013.01) [G06K 19/07758 (2013.01); G06K 19/07786 (2013.01); H01Q 1/38 (2013.01); H01Q 7/00 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A radio frequency identification (RFID) tag for attachment to an attachment object, the RFID tag comprising:
an inlay, the inlay including an IC chip configured to store identification information, a loop conductor connected to the IC chip, and an antenna unit connected to the loop conductor;
a magnetic sheet laminated on an attachment object side of the inlay; and
a spacer layer disposed between the magnetic sheet and the attachment object, wherein the spacer layer is formed of a material that is deformable together with the inlay and the magnetic sheet in response to an external force,
wherein the spacer layer comprises an insulating layer made of a material selected from woven fabric, non-woven fabric, or inorganic materials.