US 12,321,801 B2
Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card
David Finn, Fussen Weissensee (DE); Darren Molloy, Killour (IE); and Daniel Pierrard, Killour (IE)
Assigned to Metaland LLC, Doral, FL (US)
Filed by Metaland LLC, Doral, FL (US)
Filed on Sep. 6, 2022, as Appl. No. 17/903,886.
Application 17/903,886 is a continuation in part of application No. 17/882,568, filed on Aug. 7, 2022.
Application 17/903,886 is a continuation in part of application No. 17/882,569, filed on Aug. 7, 2022.
Application 17/903,886 is a continuation in part of application No. 17/866,547, filed on Jul. 17, 2022, granted, now 11,948,036.
Application 17/903,886 is a continuation in part of application No. 17/857,912, filed on Jul. 5, 2022.
Application 17/903,886 is a continuation in part of application No. 17/839,521, filed on Jun. 14, 2022, abandoned.
Claims priority of provisional application 63/349,106, filed on Jun. 5, 2022.
Claims priority of provisional application 63/345,430, filed on May 25, 2022.
Claims priority of provisional application 63/334,671, filed on Apr. 26, 2022.
Claims priority of provisional application 63/283,561, filed on Nov. 29, 2021.
Claims priority of provisional application 63/241,005, filed on Sep. 6, 2021.
Prior Publication US 2023/0086189 A1, Mar. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G06K 19/02 (2006.01); B29C 45/14 (2006.01); G06K 19/077 (2006.01)
CPC G06K 19/07724 (2013.01) [B29C 45/14647 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A smartcard (SC) comprising:
a first metal layer (ML) having a top surface, a bottom surface, and a module opening (MO) extending between the top and bottom surfaces for receiving a transponder chip module (TCM); and
a first layer of thermosetting resin encapsulating the bottom surface of the first metal layer and filling the module opening of the first metal layer;
further comprising:
a second metal layer (ML) having a top surface, a bottom surface, and a module opening (MO) extending between the top and bottom surfaces for receiving the transponder chip module; and
a second layer of thermosetting resin disposed on the bottom surface of the second metal layer and into the module opening of the second metal layer.